SEMI-compliant 12-inch wafer thickness and shape measurement system
12" wafer full inspection accelerated, can also be used for full inspection of wafers.
The TTV, Bow, and Warp measurements of the entire wafer can be performed. With a measurement speed of up to 70,000 points per second, it is possible to measure the entire surface in about 2 minutes with a pitch of 160 µm in the XY direction. This is a full system equipped with software compliant with SEMI standards. The sensors used can be selected from our spectral interference sensor 2IT DW series, allowing for high-precision measurements with a Z resolution of 1 nm or better. The high-speed measurement of the entire wafer is made possible by our area scanner FSS310, which is incorporated into the system.
- Company：プレシテック・ジャパン
- Price：10 million yen-50 million yen
